Technical Specification

Main Feature

1.WithCMSsensorwith5millionpixel,themageisclearer,italsocansupportsmallertargetplate,greatlyreducing
the weight of the target plate.
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2.WithAmericanXilinxhighperformanceFPGAand 128MBDDR2cache,theimage signal isprocessedathighspeed,
whichisalso useful forthe target platerecognition and theCPU loadof thecomputerisreduced.
3.Thecamera sfullyintelligent,embeddedV3Dimagepreprocessing algorithm,savingUSBbandwidth,improvingthe
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inbackstage,greatlyreducing the difficulty of developing alignment software.
4.The camera is highly integrated.The main chips are packaged in BGA and QFN, and chip pins arehidden inside.
The chipmounterisusedforwelding.Theoxidationresistanceandreliabilityarebetter,prolongservicelifeby2times,
greatlyreduce after-salesservice.